Selected engineering work

Problem: Integrate LTE-M, LoRa, GNSS, and Iridium into a rugged embedded platform.
Approach: Partition RF domains, enforce power-domain arbitration (LTE/Iridium mutually exclusive), and document constraints for validation.
Constraints: Coexistence, antenna layout, power budget, certification path.
Outcome: Compliance-driven architecture with clear test and production paths.

Problem: Serializer/deserializer link design and layout optimization under EMI constraints.
Approach: DS90UB948 architecture, LVDS/OpenLDI handling, SI cleanup and EMI mitigation.
Constraints: Cable/connector behavior, common-mode management, emissions risk.
Outcome: Design optimization including removal of unnecessary CMCs based on measured behavior.

Problem: High-density interconnect under mechanical constraints and class reliability targets.
Approach: Multi-layer rigid-flex stackups, controlled impedance routing (100Ω differential), fabrication-aware constraints.
Constraints: Bend regions, via strategy, yield and inspection risk.
Outcome: Stackup and routing aligned to Class 3 reliability targets.

Problem: Robust power design across battery domains and harsh environments.
Approach: Buck/boost selection, protection strategy (TVS), and fault-tolerant behavior design.
Constraints: Transients, brownout behavior, production tolerances.
Outcome: Stable power domains with explicit failure modes and validation plans.

Problem: Build an audit-friendly compliance story across multiple labs and standards.
Approach: Full TCF structuring, lab report integration (Eurofins/MET Labs), RED cybersecurity documentation, RF exposure justification.
Constraints: Evidence traceability, revision control, regulator expectations.
Outcome: Complete documentation package aligned to certification and production.